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Apple is said to start producing a key wireless chip currently provided by Broadcom next year. Apple's ambition to use self-developed components on its equipment will include switching to Bluetooth and Wi-Fi connection chips developed by itself from next year, which will replace some components currently provided by Broadcom. According to informed sources, this chip code-named Proxima has been developed for several years, and now it is planned to start the first batch of production in 2025. Like other self-developed chips of Apple, Proxima will be produced by its partner TSMC. This plan is independent of Apple's much-anticipated plan to replace the Qualcomm wireless modem, but the two parts will eventually work together. People familiar with the matter said that Apple's goal is to develop an end-to-end wireless solution that is tightly integrated with other components and more energy-efficient.The Canadian dollar fell to 1.4210, the lowest since April 2020.The Baltic dry bulk freight index fell 0.38% to 1051 points.

Medical staff: Israeli air strikes on houses in Nu Sillat refugee camp in central Gaza killed at least 20 Palestinians.Hikvision: The controlling shareholder has obtained a commitment letter for a special loan of 120 million yuan to increase its holdings. Hikvision announced that the company recently received a notice from the controlling shareholder, CLP Hikvision, that CLP Hikvision has obtained a commitment letter for a special loan to increase its holdings issued by China Industrial and Commercial Bank of China. Hangzhou Branch of Industrial and Commercial Bank of China will provide a loan fund of no more than 120 million yuan for CLP Hikvision Group to increase its shareholding in Hikvision by centralized bidding, and the loan period will not exceed 3 years.Philadelphia SE Semiconductor Index reached its highest level in more than a week, rising by 3.1%.

Governor of Poland's central bank: Poland will continue to achieve the CPI target.Huangshan Capsule: It is planned to distribute a cash dividend of 0.27 yuan for every 10 shares. Huangshan Capsule announced that the company held the board of directors and the board of supervisors on December 13, 2024, and reviewed and approved the profit distribution plan for the first three quarters of 2024. According to the plan, the company plans to distribute a cash dividend of RMB27 to all shareholders for every 10 shares based on the existing total share capital of 299 million shares, with a total cash dividend of RMB8,075,700. This profit distribution will not send bonus shares, and capital reserve will not be converted into share capital.Bosch has reached a preliminary agreement with the U.S. Department of Commerce, and will receive a chip subsidy of 225 million U.S. dollars. On December 13, local time, the U.S. Department of Commerce announced that it has reached a preliminary agreement with Bosch, a German auto parts supplier, to provide it with a subsidy of up to 225 million U.S. dollars for producing silicon carbide power semiconductors in California. This fund will support Bosch's planned investment of $1.9 billion to transform its manufacturing plant in Roseveare, California to produce silicon carbide (SiC) power semiconductors. The US Department of Commerce will also provide Bosch with about $350 million in government loans.